At the 70th annual IEEE International Electron Devices Meeting (IEDM 2024) in San Francisco, CA, USA (7–11 December), nanoelectronics research center imec of Leuven
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Today's MOSFET innovations respond to the demand for high-power devices, efficient power supplies, and widespread electrification.
As the next step in their strategic co-operation, STMicroelectronics of Geneva, Switzerland has reached a multi-year agreement from 2026 to supply its silicon carbide (SiC) power modules.
The US Department of Commerce has signed three separate preliminary memoranda of terms (PMT) under the CHIPS and Science Act to provide proposed direct funding of the following projects