At the 70th annual IEEE International Electron Devices Meeting (IEDM 2024) in San Francisco, CA, USA (7–11 December), nanoelectronics research center imec of Leuven
chip
The idea of chiplets is simple: develop the best semiconductors for the needed functions using the most proper manufacturing process.
Intel Foundry unveiled new breakthroughs to help drive the semiconductor industry forward into the next decade and beyond.
The new RZ/T2H chip combines multiple cores, real-time control, Ethernet, and advanced security into a one-chip microprocessor.
As part of the program announced in October 2024, STMicroelectronics of Geneva, Switzerland has disclosed further plans to reshape its global manufacturing footprint that will “future proof our integrated device manufacturer model with strategic
Infineon’s latest EDT3 IGBT chip technology is now integrated into the HybridPACK™ Drive G2 automotive power module.